Appearance: amber-reddish brown liquid 
Properties: high heat resistance, excellent chemical resistance, Resin after curing shows good heat resistance and chemical stability. CCL is mainly used to shield ultraviolet rays. 
Relative molecular mass: 422; 
actual product common epoxy equivalent: 117 ~ 134g / mol; 
epoxy value: 0.75 ~ 0.85mol / 100g; 
corresponding Purity: 0.8 ~ 0.9 (unit mass AG80 relative content); 
tetraglycidylamine type Epoxy Resin is characterized polyfunctional, low viscosity, high activity, adhesion and strong, crosslinked cured products Density, low shrinkage, has excellent mechanical properties, heat resistance and corrosion resistance, but poor heat resistance. 
activity-bis 10 times the phenol A type Epoxy Resin, the tertiary amine promotes the ring opening of the epoxy group. It is cured with diaminodiphenyl sulfone (DDS) curing agent, the tensile modulus is 3.7GPa, and the thermal expansion coefficient is 5.7×10K. High heat, Tg about 246 ° C. Boron trifluoride - monoethylamine as a promoter can accelerate the curing reaction.

4,4'-Methylenedianiline Epoxy Resin, industrially produced tetraglycidylamine Epoxy Resin has an actual functionality of approximately 3-3.5. It can be cured with aromatic amines, anhydrides, dicyandiamide and Imidazole curing agents. Properties such as knot, heat resistance and high modulus can be made into high performance carbon fiber composites. 4,4'-Methylenedianiline Epoxy Resin /4,4'-diaminodiphenyl sulfone / boron trifluoride ethylamine complex The system has become a typical matrix system for 170-degree cured carbon fiber composites. It has been used as a composite of composite substructures and aerospace structural composites. It can also be used as a conductive adhesive for heat-resistant adhesives. Thermal aging of 4,4'- Diaminodiphenylmethane Epoxy Resin heat resistant adhesive (using 4,4'-diaminodiphenylmethane as curing agent).